sai priya
Bis 2021, Process Engineer, Huawei Technologies
Munich, Deutschland
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Werdegang
Berufserfahrung von sai priya
9 Monate, Okt. 2018 - Juni 2019
Master thesis
Fraunhofer Institute for Applied Optics and Precision Engineering
• Developed manufacturing processes by designing and modifying equipment for fabricating and assembling using Creo. • Determination of thermo-mechanical stresses, Static forces effecting the assembly using Ansys workbench. • Manufacturing of Optomechnical systems by using solderjet technology using lead- free solders • Assures product quality by determing the shear stress and Environmental tests. • Performing environmental tests in thermal transient analysis
7 Monate, März 2018 - Sep. 2018
HIWI at Design and development Engineer
Fraunhofer Institute for Applied Optics and Precision Engineering
• Evaluated opto-mechanical systems by designing and conducting research programs; applying principles of mechanics, thermodynamics, and pressure equalization. • Selection of vacuum compatible feedthroughs in order to built the test setup. • Purchasing and installing equipment. • Alignment of opto-mechanical components using solder jet soldering
7 Monate, Feb. 2018 - Aug. 2018
Development Engineer
TITK e.V.
• Develop, configure and optimize processes from inception through to start up. • Creating process window for developing Thermoplastics starch on twin screw extruder. • Collected data required to make improvements and to innovative solutions to improve production rates and quality of output • Using scientific principles related to visocity. • Created and managed process documentation and operating instructions
Ausbildung von sai priya
Mechanical Engineering
Ernst-Abbe-Hochschule Jena – University of Applied Sciences
Sprachen
Deutsch
Gut
Englisch
Fließend