minghao jin
Bis 2015, Engineer, Infineon Technologies
Eschborn, Deutschland
Über mich
- An integrity, dignity and reliable consultant provide you with quality engineering service. - Develop microelectronics from concept to mass production. - Specialties: power semiconductor, silicon architect, TCAD simulation, reverse engineering, Intellectual property, computer algorithm, technology roadmap and marketing strategy. 2005 – Discovered 275degC Smart Cut 2006 – Pseudo-MOS testing system for Andor CCD 2009 – Released automotive grade power semiconductors 2012 – Managed London Olympic Inspired program (children choir) 2013 – Coordinated 32-bit ECU chip for EV 2014 – Solved DrMOS PMIC bottleneck problems 2015 – Designed HV IGBT module in high speed railway 2016 – Built thermal impedance model for Apple 2018 – Reduced $4M by procuring key component 2020 – Developed galvanic isolation chip 2022 – Support electric vehicle development for ADAS BEV * 86 commercial inventions (incl.7 US patents) plus a couple of academia publication as visiting professor.
Werdegang
Berufserfahrung von minghao jin
1 Jahr und 1 Monat, Aug. 2022 - Aug. 2023
Technical Consultant
htsg
4 Jahre, Mai 2018 - Apr. 2022
engineer
XFAB
8 Monate, Okt. 2017 - Mai 2018
Technology Consultant
diverse electronic clients, e.g. Samsung
- 80V OptiMOS-5 DOE through 8 inch FEOL, BEOL and preassembly
9 Monate, März 2014 - Nov. 2014
Senior Principal Design Engineer
Dynex Semiconductor Ltd
7 Monate, Mai 2013 - Nov. 2013
Technology Consultant
ChangAn HQ
5 Jahre und 10 Monate, Mai 2007 - Feb. 2013
Principal Engineer
NXP Semicondutors
Ausbildung von minghao jin
5 Jahre und 4 Monate, Sep. 2001 - Dez. 2006
electrical and electronic engineering
Queen's University Belfast