Sergey Vorobyev

Sales of process equipment for manufacturers of semiconductor devices

Support for new business development - sales of materials and components for IC assembly - planning of business development - seeking for suppliers - meetings and negotiations with customers, presentation of products - finding out customers’ needs and requirements - making proposals based on project requirements - negotiating, writing and signing contracts, monitoring of contract execution - participation in trade shows, conferences and seminars

Multichip Modules and Hybrids technical roadmap development - planning of MCMs and Hybrids manufacturing technology development - technological partners seeking and selection Project management of MCM and Hybrids development - project planning and control - contractors seeking and selection - contract negotiation, monitoring of contracts execution MCM and Hybrids business development - seeking for new customers - new R&D projects initiation - new products promotion

- Leadership in packaging processes – die bonding and wire bonding - Process development and optimization, yield enhancement for new products and process transfer from R&D lab to production site - Providing technical support for shift engineers - Process troubleshooting

Packaging process development and production start up of LED high volume production

- Active sales of the process equipment to the company’s customers, seeking for the new customers - Meetings and negotiations with customers, presentation of equipment to be sold - Finding out the customer’s needs and requirements - Making proposals and equipment specifications based on the project requirements - Negotiating, writing and signing a contract, monitoring of a contract execution - Participating in the company’s trade shows, conferences and seminars

Seeking and selection of processes and equipment based on project requirements Technical negotiations with equipment suppliers, project requirements specification, selection of equipment and its configuration, tooling specification -Equipment capacity evaluation, calculation of required units of equipment - Development of alternative solutions for project implementation (top management makes the final decision on suppliers selection) Scheduling of project execution

- Customer relations management - Management of orders registration and processing - Coordination of production operation

- Design of printed circuits (single- and double sided boards) - Interaction with PCB manufacturers (selection of manufacturer, orders execution monitoring)

- Technological support and troubleshooting - Interaction with customers, orders evaluation and processing - Production management

Semiconductor material science, solid state electronics, optoelectronics, CMOS technology, IC fabrication processes - wafer processing (FEOL, BEOL), wafer dicing, IC packaging and test.