BANUPRIYA ARUMUGAM

Angestellt, IC Package Design Engineer, Intel Deutschland GmbH

Neubiberg, Deutschland

Fähigkeiten und Kenntnisse

Perl
XML
C (programming language)
Calibre DESIGNrev
Calibre SVRF
Mentor XPCb
Packaging Technology
Packaging Design
Packaging
AutoCAD

Werdegang

Berufserfahrung von BANUPRIYA ARUMUGAM

  • Bis heute 6 Jahre und 5 Monate, seit Feb. 2018

    IC Package Design Engineer

    Intel Deutschland GmbH

    • Specialized in Wafer level and System in Packaging techniques • Designed SESUB embedded die/module with innovative passive component integration for 5g platform • Actively aligned with Co-designers, chip designers through various development stage to optimize layout and pin map • Defined concepts and implemented daisy chain packages for RF transceiver and Power Management units and constantly had project partner interactions with reliability teams • Provided package related drawings

  • 2 Jahre, Feb. 2016 - Jan. 2018

    CAD Software Engineer

    Intel Deutschland GmbH

    • Key role in the execution and development of automation solutions for productive tapeouts in various sub-micron technology platforms using perl • Verifying DRC results, Kerf and Seal ring checks in the layouts before Mask release • Developed rule check files for a sub-micron technology • Developed utilities to input data, check status, log file generation and viewing for in-house webpage using XML • Carrying out timely data transfers and effective communication with foundries

  • 4 Monate, Apr. 2015 - Juli 2015

    Research Intern

    ALTEN Engineering, Munich

    • Embedded development and testing for building automation systems using integrated STM32 microcontrollers. • Writing test scripts in embedded C for module testing of Bus manager and flash manager. • Implementing integration and system tests and reporting errors in TRAC bug tracking system.

  • 3 Monate, Mai 2014 - Juli 2014

    Research assistant

    Fraunhofer AISEC, Munich

    • FPGA implementation for flexible testing of Bistable Ring PUFs • Developing a complete test-bench for performing system tests.

  • 1 Jahr und 9 Monate, Jan. 2012 - Sep. 2013

    Senior Systems Executive

    Cognizant Technology Solutions

    • To develop and virtualize application Software Packages and Desktop Virtualization for any given target platform. • Repackaging software's to Windows Installer format • Automating software applications with response files or silent switches using VB script • Software Compatibility Testing and Microsoft office migration for Windows 7 • Testing and Quality Analysis for all the packaged applications

Ausbildung von BANUPRIYA ARUMUGAM

  • 2 Jahre und 4 Monate, Okt. 2013 - Jan. 2016

    Communication Electronics

    Technische Universität München, München

    Embedded Systems and Security, Chip Multicore Processors, Electronic Design Automation, Memory Technology, System-On-Chip Technologies, Testing Digital Circuits, Advanced Computer Architecture, Nano Electronics,, VHDL laboratory, SystemC laboratory, NanoElectronics Laboratory

  • 3 Jahre und 9 Monate, Aug. 2007 - Apr. 2011

    Electronics and Communication

    Anna University, Chennai (India)

    Electron Devices, Circuit Theory, Electronic Circuits, Linear Integrated Circuits, Digital electronics, Data Structures, Material Sciences, Microprocessors & Microcontrollers, Signals & Systems, Digital Signal processing, Communication Theory, Cellular & Mobile Communication, Embedded Systems

Sprachen

  • Deutsch

    Grundlagen

Interessen

Travelling
Reading
Sports
Music (listening )

21 Mio. XING Mitglieder, von A bis Z